|Staff Pathfinding Engineer [2018-2019]
||Responsible for developing metrology strategy for media through the backend fab process and
| Intel packaging architecture (Client and Handheld products) lead for media, laser-mark,
handling and inspection modules. Own future outlook and needs for metrology, process,
equipment, engineering-hiring and external suppliers.
|Managed MIHL (Media, Inspection, Handling and Laser) laboratory serving 45 engineers,
conducted training, mentorship and build up prototyping capabilities.
|Senior Pathfinding Engineer [2016-2018]
||Responsible for developing inspection metrology for TPE-adhesive substrate program to reuse
media resulting in savings of $75MM+ NPC over 4 years.
|Project lead for supply-chain imaging metrology for TPE-adhesive. Solely-responsible for
developing/managing equipment installed across LVM/HVM and supply-chain sites. Developed
modular inspection optics/vision stack to be installed as “plug-and-play” into various
|Senior R&D Packaging Engineer [2013-2015]
||Drove development of proprietary algorithms for void detection in layered TPE stacks and
enabled PSA delamination detection using 2D and 3D vision with partnership from top industry
experts in the machine vision industry.
|Researched and developed targeted 20μm FM classification programs ability to segregate FM
based on shape, size, contrast, micron-level location, material composition resulting in
$4MM+ savings in media yield.
|Conducted large scale Monte-Carlo simulation using 1.6M particle images to determine optimal
clustering parameters, enabling detection of contamination signatures.
|Developed 3D Warpage metrology capable of 10μm repeatability on semi-translucent
thermo-plastic elastomer surface using 3D laser profilometry.
|Developed human finger-print detection using DBSCAN and K-Means clustering on individual
residue particles (20μm-350μm size) adhered to skin.
|Investigated source of contamination by matching defect signatures in 30M particle image
database. Provided exploratory data analysis to drive cleanroom efforts resulting in $5MM+
|Developed full-stack real-time dashboard for HVM production monitoring collecting 500K
images per day framework.
|Analyzed surface defect images from SEM using Vision Pro, quantified roughness modulation
due to impregnation of CF/CNT/PTFE in PC material.
|Lead research, development and qualification of ultra-high precision Z-axis cartesian robot
with submicron repeatability for measuring μN level contact force resulting from Die-TPE
|Architected Tool-Data-Exchange (XML based) standard for inspection of 150 imaging parameters
interfacing with Oracle DB and HADOOP computing architecture. Develop specifications for
network storage for 1TB/day RAW 1.5 gigapixel images.
|R&D Packaging Engineer [2011-2013]
||Conceived, developed, qualified and proliferated processes for 32nm matrix BGA
strip/substrate handling. Delivered 50 DPM performance on robotic systems handling matrix
BGA strips and singulated substrates for HVM.
|Successfully transferred 32nm, 22nm and 14nm nodes for pick-n-place HVM processes.
Specifically, drove and deployed disruptive technologies in high speed machine vision
systems used for measurement of a wide range of features and defects.
|Utilized CAD tools to perform product/media interactions, strip warpage, end-effector design
and compliance, chip package KOZs and design rules, interference and dimensional analysis,
rapid prototyping, reverse-engineering of mechanisms and parts.
|Developed and innovated wireless telemetry for vibration characterization on high-speed
Cartesian robotic maneuvers to improve quality/yield. ISO 18436-2 training certification in
|Researched and investigated particle cleaning technologies for high-speed cleaning of
polymer materials. Conducted experiments to study ultrasonic, turbulent agitation,
supersonic CO2 blasting, and UPW spray technologies.